Metrology
 
 HOME > Àåºñ Á¤º¸
ÀåºñÁ¤º¸
Àåºñ¸í KLA Tencor Candela CS920
¸ðµ¨¸í CS 920 Á¦Á¶»ç KLA TENCOR
¿þÀÌÆÛ»çÀÌÁî 6" Vintage 2014-12
¸Å¸Å»óÅ ÆÇ¸ÅÁß Àåºñ»óÅ AS-IS
Á¦¿ø The Candela CS920 wafer inspection system is designed for power device manufacturers to provide defect inspection and accurate process feedback.
This enables the industry to improve SiC substrate quality as well as the epitaxial growth yields for both SiC epi and GaN-on-silicon processes.
The CS920 enables significantly enhanced yield and reduced time-to-root cause by integrating surface defect detection and photoluminescence technology i one inspection platform.

- Optical Head with dual laser and multi-channel detectors.
- Wafer size : up to 200mm (Currently 150mm configured)
- Wafer thickness 350 - 1500 um
- Fully automated cassette-to-cassette wafer handling
- for measurement and analysis of front-surface and buried defect on SiC, GaN substrate and EPI
(Particle / Scratch / Stain / Carrot/ Stacking fault / Pit / Crack /...)
- 0.06 um defect sensitivity (PSL on Si)
- Photoluminescence

*. To be refurbished.
*. Installed in Clean-room.
       
  - ÃæÃ»³²µµ õ¾È½Ã µ¿³²±¸ ÅëÁ¤3·Î 3 (ÁÖ)Á¦³×½Ã½º ¿ì)31208 TEL: 041-554-6920~1 FAX: 041-554-6922